Processing - Dicing Saw

The CEDT operates a Microace 3 dicing saw. Diamond impregnated resin blades are used for cutting materials ranging from semiconductors and glasses to multilayer laminate structures.

The quality of the cut can be tailored to the requirements of the particular task. Quick, rough cuts can be used to dice wafers for packaging. The saw can also be used for applications requiring greater control and precision, such as the cutting of facets suitable for waveguide coupling.

The dicing saw is located in TAB 205.